Dell PowerEdge R660 Dual Xeon Gold 6526Y, 64 GB DDR5, PERC H755, 1,92 TB SSD's en dubbele 1800 W PSU
  • Productcategorieën:Servers
  • Onderdelennummer:Dell PowerEdge R660
  • Beschikbaarheid:In Stock
  • Conditie:Nieuw
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  • Oorspronkelijke prijs:$9,999.00
  • Uw prijs: $8,700.00 U bespaart $1,299.00
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Title

Dell PowerEdge R660 Dual Xeon Gold 6526Y, 64 GB DDR5, PERC H755, 1.92TB SSDs & Dual 1800W PSU

Keywords

Dell PowerEdge R660, Xeon Gold 6526Y, 64GB DDR5-5600, PERC H755 RAID, 1.92TB SSD, dual 1800W PSU, Broadcom 57414 10/25GbE NIC, OCP NIC 3.0

Description

The Dell PowerEdge R660 is a 1U, dual-socket server platform designed for high performance, dense compute and scalable storage applications. According to the Dell R660 technical specification sheet, it supports up to two Intel Xeon Scalable processors, multiple drive configurations, and high memory bandwidth. 

Your specified configuration includes dual **Intel Xeon Gold 6526Y** CPUs (16 cores, DDR5-5200 support) running in a 2-CPU setup.

This gives you strong parallel compute capacity while staying within the platform’s thermal and power envelope (both CPUs are specified for < 250W in your module table).

The configuration explicitly states “No HBM” (no High Bandwidth Memory) and uses performance heatsinks suited for < 250W CPUs.

Memory in this build is a **64 GB DDR5-5600 RDIMM** (dual rank) module under a “Performance Optimized” memory profile. Though only one 64 GB DIMM is listed, the system supports many more; future expansion is possible. The configuration mentions 5600 MT/s speed for the memory type.

On storage, your build uses PERC H755 RAID with rear load brackets, combined with **1.92 TB SSDs (SATA, Mixed Use, 6 Gbps, 512e, hot-plug)** drives.

The RAID setting is “unconfigured RAID,” meaning you can set RAID levels (0/1/5/6 etc.) across mixed drive types. The module table states “mixed drive types allowed.”

Connectivity includes a Broadcom 57414 dual 10/25GbE OCP NIC, plus a Broadcom 5720 dual 1GbE LOM, and optionally an Intel i350 quad 1GbE adapter.

You also list a Fibre Channel adapter (Emulex LPe35002 32G). This gives you flexibility across Ethernet and FC SAN networking.

Power is robust: dual 1800W hot-plug redundant (1+1) Titanium PSUs (for 200–240 V AC) are selected, providing significant headroom for CPUs, SSDs, NICs, and high I/O loads.

The system includes 4 very high performance fans for cooling, and supports PCIe riser slots (3 × x16 LP) via a riser config.

Rail kit (ReadyRails sliding with cable management arm) is included, along with iDRAC9 Enterprise 16G for remote management, and TPM 2.0 V6 for trusted platform security.

Overall, this configuration is a balanced, high-performance enterprise build suitable for database, virtualization, storage gateway, or mixed compute + storage workloads.

Key Features

  • Dual Intel Xeon Gold 6526Y CPUs (16C/32T each) for high parallel compute performance Xeon Gold 6526Y
  • 64 GB DDR5-5600 RDIMM (dual rank) under performance optimized mode 64GB DDR5-5600
  • PERC H755 RAID controller with rear load bracket, supports mixed drive types PERC H755 RAID
  • 1.92 TB SSDs (SATA Mixed Use, hot-plug) with capacity for expansion 1.92TB SSD
  • Dual 1800W Titanium redundant PSU (1+1) for power reliability dual 1800W PSU
  • Broadcom 57414 10/25GbE OCP NIC for high bandwidth networking Broadcom 57414 NIC
  • Multiple networking options including 1GbE LOM and optional i350 quad adapter
  • iDRAC9 Enterprise, TPM 2.0 V6, ReadyRails, and robust fan cooling system included

Configuration

Module / ComponentSelected Option / Value
Base ServerPowerEdge R660 (210-BEQQ)
TPMTrusted Platform Module 2.0 V6
Chassis2.5" chassis with up to 10 SAS/SATA drives, 2 CPU support (PERC11 backplane)
Processor 1Intel Xeon Gold 6526Y 16C/32T 2.8 GHz
Processor 2Intel Xeon Gold 6526Y (same)
HBM OptionNo HBM
CoolingPerformance heatsink for 2 CPU (< 250W) configuration
Memory ProfilePerformance Optimized
Memory Type / SpeedRDIMM at 5600 MT/s
Memory Capacity64 GB (dual rank)
RAID ConfigurationUnconfigured RAID (mixed drives allowed)
RAID / ControllerPERC H755 with rear load brackets
Drives1.92 TB SATA SSD (6 Gbps, mixed use, 512e, hot-plug)
BIOS SettingPower Saving mode
Boot ModeUEFI GPT
Cooling Fans4 Very High Performance Fans
Power SupplyDual 1800W Titanium redundant (1+1)
Power CordC15/14 2m PDU Style 10A
PCIe RiserConfig 1: 3 × x16 LP slots (Gen4)
Motherboard ConstraintSupports only CPUs < 250W (cannot upgrade above 250W) per MLK board
NetworkBroadcom 57414 dual 10/25GbE OCP NIC + Broadcom 5720 LOM + optional Intel i350 quad NIC
Fibre ChannelEmulex LPe35002 dual 32G FC HBA
Optics & CablesSFP28 SR 25GbE, passive twinax cabling, no DPU cables
BezelNone
BOSS / Boot CardNone
Management / SecurityiDRAC9 Enterprise 16G, TPM 2.0 V6, iDRAC Group Manager enabled
RailsReadyRails sliding rails with CMA (Cable Management Arm)
Warranty / ServicesParts Only 12 months (no extension)

Compatibility

The Dell PowerEdge R660 supports 4th Generation Intel Xeon Scalable processors. :contentReference[oaicite:1]{index=1} In your configuration, the use of dual Xeon Gold 6526Y is valid so long as the motherboard (MLK) supports CPUs < 250W, which your module table indicates. (“Motherboard supports ONLY CPUs below 250W”)

Memory is DDR5 RDIMM up to 5600 MT/s depending on population and DIMM layout. The R660 specification states support for DDR5 speeds (e.g. 4800 MT/s, 5600 in certain modes) for single DIMM per channel configurations. :contentReference[oaicite:2]{index=2}

The PERC H755 RAID controller is a supported RAID option in PowerEdge systems, provided firmware is updated and the rear-load bracket is matched to the chassis layout. The drive mix (SATA SSDs) should work on PERC H755 given support for mixed drive types is enabled in your RAID configuration option.

Networking components (Broadcom 57414, 5720, Intel i350) are compatible as long as the server has the proper OCP / PCIe slots and drivers loaded. The 57414 is commonly offered as OCP NIC 3.0 for 10/25GbE in Dell servers.

Power supply specification (dual 1800W Titanium) is beyond typical server thermal and power budgets but gives ample headroom for full load. Cooling via 4 high performance fans should ensure stable operation under maximum component loading.

Usage Scenarios

1) Virtualization & Cloud Hosting: This setup enables deployment of many virtual machines thanks to dual 16-core CPUs and future memory expansion. The SSDs provide low latency storage for OS or VM images.

2) Storage Front-End / Cache Node: Use the SATA SSDs (and potential future drive additions) as a rapid I/O tier in front of slower storage or as caching layers in hybrid storage architectures.

3) Mixed Compute + Network Workloads: With 10/25GbE networking and multiple NICs, this server can host network services, edge functions, or act as a gateway between subnetworks requiring high throughput.

4) Database / Analytics: The strong CPU cores, SSD storage, and RAID controller make it suitable for read/write database workloads, analytics servers, or OLTP systems with moderate scale.

5) SAN / Fibre Channel Integration: With Emulex FC HBA and dual NIC options, this server can act as a bridging node or host in SAN / Fibre Channel storage topologies or connectivity to SAN fabrics.

Frequently Asked Questions

  1. Q: Can I later upgrade to higher-TDP CPUs above 250W?
    A: No — your module table specifically states “Motherboard MLK supports ONLY CPUs below 250W.” Using higher-TDP CPUs would risk incompatibility, thermal issues or firmware rejection.
  2. Q: Is 64 GB memory sufficient?
    A: For basic OS, services, and caching it’s fine. But for heavier workloads, VM hosting, or database use, you’ll likely need to expand memory later.
  3. Q: What RAID levels should I use for the SATA SSDs?
    A: RAID 5 is okay for capacity + fault tolerance with one drive failure; RAID 6 gives two-drive fault tolerance but reduces usable capacity. Mixed drive type environments should be carefully tested.
  4. Q: Are the PCIe riser and OCP slots enough for expandability?
    A: Yes — you have a riser config with 3 × x16 LP slots and OCP NIC 3.0 slot. You can continue to add NICs, FC cards, or GPU accelerators (within power/thermal limits).
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